Together since 2007

Transforming money management to make financial markets accessible to all

Acquired since 2021

Enabling the human right of mobility to all

Acquired since 2017

Introducing Zero Trust mechanisms for a truly sale environment

Acquired since 1994

Introduced cyber security to the mass business market

Together since 2010

Harnessing the power of artificial vision to transform the lives of visually impaired

Together since 2020

Digital Learning Platform designed to optimize student engagement and learning outcome

Together since 2019

AI-driven end-to-end Fix & Flip platform

Together since 2021

First drone delivery service focused in the US suburbs.

Acquired by DG 2007

Global provider of digital advertising solutions that optimize the use of media, creative and data for enhanced performance.

Together since 2010

Leading investment house in Israel, managing over 77 Billion Dollars for private, business and institutional clients

Together since 2016

Developing and commercializing novel endovascular treatments for stroke

Together since 2012

Developing percutaneous implantable technologies for patients with chronic heart failure


SEP 8, 2015

The Telit LE866 module is the first in a new series based on Altair chipsets that will accelerate the path towards LTE MTC

LONDON– Telit, a global enabler of the Internet of the Things (IoT), today announced a cooperation with Altair Semiconductor, a leading provider of LTE chipsets. Telit has introduced the LE866 module, the first in a new series based on Altair chipsets designed to support LTE Category 1 enhancements for Machine-Type Communications (MTC).

“We expect LTE low-category devices to catalyze billions of dollars in spending by the M2M and IoT industry, and Altair is a leading vendor in this space.”

The LE866 is currently the smallest LTE module in the market. The LGA footprint is a mere 15 x 25 mm. It’s a UE Category 1 device with maximum data rate of 10 Mbps downlink and 5 Mbps uplink. The module employs Altair’s FourGee-1160/6401 IoT-optimized chipset that provides extremely low power consumption, which results in a significant increase in battery life, while reducing cost/complexity compared to traditional high-performance LTE devices.

The LE866 is software upgradable to support the power-saving mode (PSM) that 3GPP has specified for MTC in Release 12, which will be demonstrated in partnership with Altair and Ericsson during CTIA Super Mobility 2015 in Las Vegas on September 9-11. To see the demo please visit the Ericsson booth #4322, which is close to the Telit booth #5032 in the adjacent M2M section.

The LE866 will be first released commercially for the U.S. market, with additional regional variants to follow.

Release 13 of the 3GPP LTE standard, which is foreseen for March 2016, will bring further improvements on power consumption, cost/complexity and coverage for IoT and M2M applications. However, with the LE866, Telit and Altair are extending today the addressable market via power, size, and cost combination that is a significant game-changer. Ultra-small modems that support the lower categories are needed for numerous applications, including wearable devices, smart homes and smart metering, fleet management, point-of-sales and health monitoring among others.

“The decision to partner with Altair was an easy one to take,” said Felix Marchal, Chief Product Officer, Telit. “We expect LTE low-category devices to catalyze billions of dollars in spending by the M2M and IoT industry, and Altair is a leading vendor in this space.”

“Not all CAT-1 chips are created equal,” said Eran Eshed, Co-Founder and VP of Marketing and Business Development at Altair. “The great market potential for CAT-1 draws many players to try to compete. However, most are simply rebranded higher-category chipsets that are functionally compatible with CAT-1, but fall short on power consumption and die size. Our close cooperation with market leader Telit brings the first truly IoT-optimized module to the market, unlocking new use cases and expanding the IoT market.”